| Part Number: PAL 6L88B-4ML 883B | Manufacturer: Mmi Amd | NSN: 5962-01-360-1550 (5962013601550) | |
| Item Name: microcircuit memory | CAGE Code: 50364 | ||
| Alternate P/N : PAL6L88B4ML883B | |||
Please utilize the RFQ form below to submit an online quote request for NSN part number PAL 6L88B-4ML 883B of Microcircuit Memory by manufacturer Mmi Amd having CAGE Code 50364 with NSN number 5962-01-360-1550. Please also fill the requested quantity and need by date form fields for your required part PAL 6L88B-4ML 883B. This information will help us prioritize your request effectively.
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Aerospace Orbit is owned and operated by ASAP Semiconductor – an AS9120B, ISO 9001:2015, and FAA AC 00-56B distributor of Mmi Amd NSN parts. We stock difficult-to-find parts from more than 75,000 manufacturers. Request a quote for part number PAL 6L88B-4ML 883B and an account manager will contact you shortly.
Our industry relationships allow us to assure competitive prices on all obsolete parts, and shorten the supply chain to deliver as soon as possible. You will receive a response within 15 minutes from a sales representative at Aerospace Orbit. Additionally, you can call us at +1-714-705-4780 or submit a Bill of Materials (BOM) to sales@aerospaceorbit.com to expedite the purchase process.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-360-1550 Item Description: Microcircuit Memory | 5962 | 013601550 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Pal 6l88b-4ml 883b | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 303.0 MILLIWATTS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 1.00 MILLIAMPERES MAXIMUM INPUT |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUITS, DIGITAL, BIPOLAR, PROGRAMMABLE LOGIC, MONOLITHIC SILICON |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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