Please submit your quote request for NSN part AM3341DMB (Microcircuit Memory) using the RFQ form below. This part AM3341DMB is manufactured by Advanced Micro Devices Inc (34335) and carries NSN 5962-01-139-1531. To expedite processing, kindly provide the requested quantity and need-by date in the designated form fields.
For reference, this part AM3341DMB has an NSN of 5962-01-139-1531, with a NIIN of 01-139-1531 and an NCB Code of 01 (USA). It falls under FSG 59 Electrical and Electronic Equipment Components and FSC 5962 Microcircuits Electronic for classification purposes. Providing complete details ensures we prioritize your request effectively.
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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-139-1531 Item Description: MICROCIRCUIT,MEMORY | 5962 | 011391531 | N | |||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| AM3341DMB | 3 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 550.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 550.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | Memory Device Type | FIRST-IN FIRST-OUT |
| CQZP | Input Circuit Pattern | 7 INPUT |
| ADAT | Body Width | 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC |
| TTQY | Terminal Type And Quantity | 16 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | HERMETICALLY SEALED AND ASYNCHRONOUS AND EXPANDABLE AND SYNCHRONOUS |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| MRC | Decoded Requirement | Clear Text Reply |
| ADAQ | Body Length | 0.740 INCHES MINIMUM AND 0.870 INCHES MAXIMUM |
| ADAU | Body Height | 0.110 INCHES MINIMUM AND 0.130 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AGAV | End Item Identification | MWBP 60854 |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQWX | Output Logic Form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | -10.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
| SITC : 77689 | Parts of electronic integrated circuits and microassembles |
| ADPE | Represents items with no adp components |
|---|---|
| CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
| ESD | B - Represents items with esd sensitivity. |
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | A - Item does not contain precious metal. |
| ACC: | H - Instruments/equipment/supplies for radio, communications, electrical, laboratory, etc. (includes signal corps) |
|---|---|
| ADC: | A - Shipment is not a consolidation and does not exceed 84 inches in any dimension. |
| LTL: | W - Rating variable |
| NMFC: | 061700 - Elec appliances/instruments noi |
| SHC: | 9 - Other or no special handling required (sh) |
| TCC: | 3 - Electrostatic sensitive device (esd) |
| WCC: | 72D - Communications/electronics, other than sigint/ew or comsec repair parts and components |
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